___May_dong_chip_ZMR380B- Máy đóng chip ZM-R380B, Thiet bi laptop, linh kien laptop, thiet bi notebook, linh kien notebook, thiet bi may tinh xach tay, linh kien may tinh xach tay, laptop, notebook, may tinh xach tay

Features:

1. Choose imported high-precision materials (temperature sensor, PLC, heater) to control the BGA desoldering & soldering procedures precisely.

2. Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at one time.

3. This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.

4. Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.

5. Top & bottom heating can be controlled independently by the temperature graphs.A cross-flow fan cools rapidly to protect the PCB from deformation when welding.

6. After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering

Máy đóng chip BIP 400

1 Power consumption 5000W 2 Top Heater 800W 3 Bottom Heater 3rd Temperature Zone (Infrared plates) 3000W 2nd Temperature Zone (Hot-air Nozzle) 1000W 4 Power Requirement AC 220V ± 10 50Hz ± 3 5 Machine Dimension L710*W600*H660mm 6 Min. PCB size 20*20mm 7 Max. PCB size 500*450mm 8 Weight 45kg

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Máy đóng chip ZM-R380C

1 Total power 3000W 2 Top heater 800W 3 Bottom heater 2000W 1 Total power 3000W 2 Top heater 800W 3 Bottom heater 2000W
4 Power supply single-phase 220VAC 50/60Hz 3KVA
5 Machine Dimension 450×380×580mm
6 Positioning V-groove for PCB positioning, Max PCB size: 320 × 300mm
7 Temperature control high-precision K Sensor thermocouple
8 Weight of machine about 25kg 4 Power supply single-phase 220VAC 50/60Hz 3KVA 5 Machine Dimension 450×380×580mm 6 Positioning V-groove for PCB positioning, Max PCB size: 320 × 300mm 7 Temperature control high-precision K Sensor thermocouple 8 Weight of machine about 25kg

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Máy đóng chip ZM-R590

THÔNG SỐ KỸ THUẬT
1. Tổng công suất: 4600W
2. Đầu nhiệt trên: 800W
3. Hệ thống nhiệt dưới: mâm nhiệt ceramic 3000W và đầu nhiệt hơi nóng 800W
4. Nguồn điện: một pha 220V 50/60Hz 5KVA
5. Thể tích máy: 810 x 680 x 660mm
6. min PCB size: 20 x 20mm, max PCB size 450 x 400mm
7. Nặng: 50kg.

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Máy đóng chip ZM-R5860

1 Power consumption 5200W 2 Top Heater 800W 3 Bottom Heater Infrared plate 3000 W - Nozzle 1000 W 4 Power supply (Single Phase)AC 220V 50/60Hz
5 Machine Dimension L710×W680×H660mm
6 Positioning V-groove PCB positioning
7 Temperature control high precision K-sensor（Closed Loop）
8 Max. PCB Size 400×450mm
9 Min. PCB Size 40×40mm

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Máy đóng chip ZM-R5860C

1 Power consumption 5200W 2 Top Heater 800W 3 Bottom Heater 2nd Temperature Zone (Infrared plates) 3000W 3rd Temperature Zone (Hot-air Nozzle) 1200W 4 Power Requirement AC 220V ± 10 50Hz ± 3
5 Machine Dimension L710*W680*H660mm
6 Positioning V-groove.
7 Temperature control Imported closed loop K-type thermocouple
8 Max. PCB size 450*400mm
9 Weight 45kg

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Máy đóng chip ZM-R5820N

1 Power consumpsion 4200W 2 Top Heater 800W 3 Bottom Heater the 3rd temperature area800W 4 Constant temperature heating power 2400W
5 Power supply Single phase 220V/230V 50/60Hz 4.5KVA
6 Machine Dimension 450×550×650mm
7 Positioning V-groove for PCB positioning, Max PCB size 280×395mm
8 Temperature control high-precision K sensor
9 Weight of machine about 38kg

32.000.000 VND